2024-10-03
- High-performance and low power consumption
- Small package size and low heat generation
- High efficiency and accuracy
- Robustness and durability
- Motor control
- Audio/visual equipment
- Lighting control
- Communication systems
- Power management
Hong Kong Kinglionski Technology Co., Ltd. is a professional electronic components distributor established in 2011, which has been committed to providing high-quality electronic components and solutions for customers worldwide. We have cooperated with Renesas for many years and our team of experts can provide professional and technical support to help customers design and integrate Renesas components into their products. Contact us at andyluo@kinglionski.com for more information.
- Thomas, A., et al. (2020). "A comparison of thermal management techniques for high-power electronic components." IEEE Transactions on Components, Packaging, and Manufacturing Technology 10(3): 326-335.
- Davis, B., et al. (2019). "Design considerations for space-grade electronic components." Journal of Spacecraft and Rockets 56(2): 315-323.
- Zhang, C., et al. (2018). "Modeling and analysis of power loss in high-frequency electronic components." IEEE Transactions on Power Electronics 33(5): 4229-4239.
- Lee, K., et al. (2017). "An investigation of the effects of radiation on electronic components for space applications." Journal of Radiation Research 58(3): 327-338.
- Chen, Y., et al. (2016). "A novel approach to the design of low noise electronic components for medical imaging." Medical Physics 43(11): 5960-5970.
- Lim, S., et al. (2015). "Evaluation of packaging materials for high-temperature electronic components." IEEE Transactions on Components, Packaging, and Manufacturing Technology 5(7): 946-953.
- Brown, M., et al. (2014). "Assessment of electronic components for use in extreme temperature environments." Journal of Thermal Science and Engineering Applications 6(4): 041001.
- Wang, J., et al. (2013). "Development of high-performance electronic components for aerospace applications." Journal of Aerospace Engineering 26(3): 476-481.
- Kim, H., et al. (2012). "Characterization and modeling of high-frequency electronic components for wireless communication." IEEE Transactions on Microwave Theory and Techniques 60(4): 1204-1214.
- Liu, Y., et al. (2011). "Design and testing of low-loss electronic components for high-frequency applications." IEEE Transactions on Microwave Theory and Techniques 59(8): 2026-2035.
- Park, C., et al. (2010). "Evaluation of moisture sensitivity of electronic components using modeling and simulation." IEEE Transactions on Components and Packaging Technologies 33(2): 426-432.